Pairing Laser Ablation and Xe Plasma FIB-SEM: An approach for precise endpointing in large-scale Physical Failure Analysis in the Semiconductor Industry

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F21%3APU142586" target="_blank" >RIV/00216305:26220/21:PU142586 - isvavai.cz</a>

Výsledek na webu

<a href="https://watermark.silverchair.com/istfa2021p0283.pdf?token=AQECAHi208BE49Ooan9kkhW_Ercy7Dm3ZL_9Cf3qfKAc485ysgAAA9swggPXBgkqhkiG9w0BBwagggPIMIIDxAIBADCCA70GCSqGSIb3DQEHATAeBglghkgBZQMEAS4wEQQM0HKzpw3lkppdn6qNAgEQgIIDjrgiClgGqXxh8-z0v_a2YSNRtMjM86UtqfLCAFk" target="_blank" >https://watermark.silverchair.com/istfa2021p0283.pdf?token=AQECAHi208BE49Ooan9kkhW_Ercy7Dm3ZL_9Cf3qfKAc485ysgAAA9swggPXBgkqhkiG9w0BBwagggPIMIIDxAIBADCCA70GCSqGSIb3DQEHATAeBglghkgBZQMEAS4wEQQM0HKzpw3lkppdn6qNAgEQgIIDjrgiClgGqXxh8-z0v_a2YSNRtMjM86UtqfLCAFk</a>

DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Pairing Laser Ablation and Xe Plasma FIB-SEM: An approach for precise endpointing in large-scale Physical Failure Analysis in the Semiconductor Industry

Popis výsledku v původním jazyce

In this work we present a large-volume workflow for fast failure analysis of microelectronic devices that combines a stand-alone ps-laser ablation tool with a SEM/Xe Plasma FIB system. In this synergy, the ps-laser is used to quickly remove large volumes of bulk material while the SEM/Xe Plasma FIB is used for precise end-pointing to the feature of interest and fine surface polishing after laser. The concept of having a standalone laser tool obeys the logic of maximizing productivity as both systems can work simultaneously and continuously. As application examples we first present a full workflow to prepare an artefact-free, delamination-free cross-section in an AMOLED mobile display. We also present applications examples that require cm-sized long cuts to cut through whole microelectronic devices, or removal of cubic-mm of material to prepare mm-sized cross-sections in packages. We discuss a way how to implement correlation data across the laser and FIBSEM platforms through SYNOPSYS Avalon SW allowin

Název v anglickém jazyce

Pairing Laser Ablation and Xe Plasma FIB-SEM: An approach for precise endpointing in large-scale Physical Failure Analysis in the Semiconductor Industry

Popis výsledku anglicky

In this work we present a large-volume workflow for fast failure analysis of microelectronic devices that combines a stand-alone ps-laser ablation tool with a SEM/Xe Plasma FIB system. In this synergy, the ps-laser is used to quickly remove large volumes of bulk material while the SEM/Xe Plasma FIB is used for precise end-pointing to the feature of interest and fine surface polishing after laser. The concept of having a standalone laser tool obeys the logic of maximizing productivity as both systems can work simultaneously and continuously. As application examples we first present a full workflow to prepare an artefact-free, delamination-free cross-section in an AMOLED mobile display. We also present applications examples that require cm-sized long cuts to cut through whole microelectronic devices, or removal of cubic-mm of material to prepare mm-sized cross-sections in packages. We discuss a way how to implement correlation data across the laser and FIBSEM platforms through SYNOPSYS Avalon SW allowin

Druh

O - Ostatní výsledky

CEP obor

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OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

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Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2021

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů