Whiskers Growth on Lead-Free Solders Under the Dynamic Stress
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F26722445%3A_____%2F15%3A%230001118" target="_blank" >RIV/26722445:_____/15:#0001118 - isvavai.cz</a>
Výsledek na webu
<a href="http://dx.doi.org/10.1166/asem.2015.1686" target="_blank" >http://dx.doi.org/10.1166/asem.2015.1686</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1166/asem.2015.1686" target="_blank" >10.1166/asem.2015.1686</a>
Alternativní jazyky
Jazyk výsledku
angličtina
Název v původním jazyce
Whiskers Growth on Lead-Free Solders Under the Dynamic Stress
Popis výsledku v původním jazyce
The research is focused on whiskers growth on thick layers of two commonly used lead-free solders that were plated on two different substrates. There were two objectives. The first was to examine the influence of the dynamic stress applied in the standard climatic conditions on solders and subsequent whiskers growth and confirm that an additional mechanical stress increase internal stress as well as whiskers growth. This can occur in many applications in an electronic industry. The second was to check the presence of whiskers in this material combination with the thick layer of solder. The experiment confirmed the occurrence of beginning whiskers grow long several micrometres on samples covered by SnCu as well as SnAgCu solders.
Název v anglickém jazyce
Whiskers Growth on Lead-Free Solders Under the Dynamic Stress
Popis výsledku anglicky
The research is focused on whiskers growth on thick layers of two commonly used lead-free solders that were plated on two different substrates. There were two objectives. The first was to examine the influence of the dynamic stress applied in the standard climatic conditions on solders and subsequent whiskers growth and confirm that an additional mechanical stress increase internal stress as well as whiskers growth. This can occur in many applications in an electronic industry. The second was to check the presence of whiskers in this material combination with the thick layer of solder. The experiment confirmed the occurrence of beginning whiskers grow long several micrometres on samples covered by SnCu as well as SnAgCu solders.
Klasifikace
Druh
J<sub>x</sub> - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)
CEP obor
JF - Jaderná energetika
OECD FORD obor
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Návaznosti výsledku
Projekt
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Návaznosti
N - Vyzkumna aktivita podporovana z neverejnych zdroju
Ostatní
Rok uplatnění
2015
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Údaje specifické pro druh výsledku
Název periodika
Advanced Science, Engineering and Medicine
ISSN
2164-6627
e-ISSN
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Svazek periodika
7
Číslo periodika v rámci svazku
4
Stát vydavatele periodika
US - Spojené státy americké
Počet stran výsledku
4
Strana od-do
296-299
Kód UT WoS článku
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EID výsledku v databázi Scopus
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