Sn and Bi whisker growth from SAC0307-Mn07 and SAC0307-Bi1-Mn07 ultra-thin film layers

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F21%3A00353555" target="_blank" >RIV/68407700:21230/21:00353555 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.1016/j.vacuum.2021.110121" target="_blank" >https://doi.org/10.1016/j.vacuum.2021.110121</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1016/j.vacuum.2021.110121" target="_blank" >10.1016/j.vacuum.2021.110121</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Sn and Bi whisker growth from SAC0307-Mn07 and SAC0307-Bi1-Mn07 ultra-thin film layers

Popis výsledku v původním jazyce

In the past years, the use of low silver content SAC0307 (99Sn0.3Ag0.7Cu wt%) solder alloy grew considerably due to its good soldering quality. In the latest version of this alloy, manganese, and bismuth are used to improve further its soldering parameters. In this study, a reliability issue, the whisker growth from SAC0307-Mn07 and SAC0307-Bi1-Mn07 solder alloys was investigated. Ultra-thin films (in 100-150 nm thickness) were vacuum evaporated from the investigated alloys onto Cu substrates. The samples were stored at laboratory conditions for 28 days. Whisker growth was followed by a scanning electron microscope, and the ultra-thin film layers structures were investigated in focused ion beam cuts. In the case of the SAC0307-Mn07, the mechanical stress due to the intermetallic layer growth resulted in whisker formation right after the layer deposition. However, Bi addition could increase the stress relaxation ability of the ultra-thin film layer; the whisker formation started only three days after the evaporation in the case of the SAC0307-Bi1-Mn07 layer. Besides, the SAC0307-Bi1-Mn07 alloy could entirely suppress the formation of filament-type whiskers that might cause reliability issues in microelectronics. Furthermore, a unique phenomenon was observed that the SAC0307-Bi1-Mn07 layer produced mostly Bi-Sn whisker couples.

Název v anglickém jazyce

Sn and Bi whisker growth from SAC0307-Mn07 and SAC0307-Bi1-Mn07 ultra-thin film layers

Popis výsledku anglicky

In the past years, the use of low silver content SAC0307 (99Sn0.3Ag0.7Cu wt%) solder alloy grew considerably due to its good soldering quality. In the latest version of this alloy, manganese, and bismuth are used to improve further its soldering parameters. In this study, a reliability issue, the whisker growth from SAC0307-Mn07 and SAC0307-Bi1-Mn07 solder alloys was investigated. Ultra-thin films (in 100-150 nm thickness) were vacuum evaporated from the investigated alloys onto Cu substrates. The samples were stored at laboratory conditions for 28 days. Whisker growth was followed by a scanning electron microscope, and the ultra-thin film layers structures were investigated in focused ion beam cuts. In the case of the SAC0307-Mn07, the mechanical stress due to the intermetallic layer growth resulted in whisker formation right after the layer deposition. However, Bi addition could increase the stress relaxation ability of the ultra-thin film layer; the whisker formation started only three days after the evaporation in the case of the SAC0307-Bi1-Mn07 layer. Besides, the SAC0307-Bi1-Mn07 alloy could entirely suppress the formation of filament-type whiskers that might cause reliability issues in microelectronics. Furthermore, a unique phenomenon was observed that the SAC0307-Bi1-Mn07 layer produced mostly Bi-Sn whisker couples.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2021

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Vacuum

ISSN

0042-207X

e-ISSN

1879-2715

Svazek periodika

187

Číslo periodika v rámci svazku

110121

Stát vydavatele periodika

GB - Spojené království Velké Británie a Severního Irska

Počet stran výsledku

8

Strana od-do

—

Kód UT WoS článku

000635459600004

EID výsledku v databázi Scopus

2-s2.0-85100624695