Whiskers Growth on Lead-Free Solders Under the Dynamic Stress

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F15%3A00238016" target="_blank" >RIV/68407700:21230/15:00238016 - isvavai.cz</a>

Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Whiskers Growth on Lead-Free Solders Under the Dynamic Stress

Popis výsledku v původním jazyce

The research is focused on whiskers growth on thick layers of two commonly used lead-free solders that were plated on two different substrates. There were two objectives. The first was to examine the influence of the dynamic stress applied in the standard climatic conditions on solders and subsequent whiskers growth and confirm that an additional mechanical stress increase internal stress as well as whiskers growth. This can occur in many applications in an electronic industry. The second was to check the presence of whiskers in this material combination with the thick layer of solder. The experiment confirmed the occurrence of beginning whiskers grow long several micrometres on samples covered by SnCu as well as SnAgCu solders.

Název v anglickém jazyce

Whiskers Growth on Lead-Free Solders Under the Dynamic Stress

Popis výsledku anglicky

The research is focused on whiskers growth on thick layers of two commonly used lead-free solders that were plated on two different substrates. There were two objectives. The first was to examine the influence of the dynamic stress applied in the standard climatic conditions on solders and subsequent whiskers growth and confirm that an additional mechanical stress increase internal stress as well as whiskers growth. This can occur in many applications in an electronic industry. The second was to check the presence of whiskers in this material combination with the thick layer of solder. The experiment confirmed the occurrence of beginning whiskers grow long several micrometres on samples covered by SnCu as well as SnAgCu solders.

Druh

O - Ostatní výsledky

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

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Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2015

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů