Vliv mechanické pevnosti elektricky vodivého lepeného spoje na jeho rezistivitu

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F02%3A00000245" target="_blank" >RIV/49777513:23220/02:00000245 - isvavai.cz</a>

Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Influence of mechanical strength of electrically conductive sticking joint on its resistance

Popis výsledku v původním jazyce

Paper dealts with electrically conductive adhesives, that are one from possible substitutes of lead solder in electronic assembly. These adhesives are mostly made up by mixture of conductive particles and resin. One of conductive mechanisms, what assertsin these adhesives, is just contact between conductive particles. Quality of this contact is among others dependent on inner stress in adhesive. Resins used for this type of adhesives of course age and especially humidity is unfriendly for them, thanksto moistening. Ageing approves also by change of mechanical strenght of sticking joint and thereby even before refering inner stress. Decrease of inner stress then reduce pressure force between individual particles and adhesive force, and thereby resistivity raise. At the end it will be presented measured value obtained at experiments.

Název v anglickém jazyce

Influence of mechanical strength of electrically conductive sticking joint on its resistance

Popis výsledku anglicky

Paper dealts with electrically conductive adhesives, that are one from possible substitutes of lead solder in electronic assembly. These adhesives are mostly made up by mixture of conductive particles and resin. One of conductive mechanisms, what assertsin these adhesives, is just contact between conductive particles. Quality of this contact is among others dependent on inner stress in adhesive. Resins used for this type of adhesives of course age and especially humidity is unfriendly for them, thanksto moistening. Ageing approves also by change of mechanical strenght of sticking joint and thereby even before refering inner stress. Decrease of inner stress then reduce pressure force between individual particles and adhesive force, and thereby resistivity raise. At the end it will be presented measured value obtained at experiments.

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

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Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2002

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

European microelectronics packaging & interconnection symposium

ISBN

83-904462-7-8

ISSN

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e-ISSN

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Počet stran výsledku

3

Strana od-do

403-405

Název nakladatele

IMAPS - Poland Chapter

Místo vydání

Cracow

Místo konání akce

Krakov

Datum konání akce

1. 1. 2002

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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