Comparison of the surface properties of power electronic substrates

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F15%3A43925339" target="_blank" >RIV/49777513:23220/15:43925339 - isvavai.cz</a>

Výsledek na webu

<a href="http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7247979&newsearch=true&queryText=Comparison%20of%20the%20surface%20properties%20of%20power%20electronic%20substrates" target="_blank" >http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7247979&newsearch=true&queryText=Comparison%20of%20the%20surface%20properties%20of%20power%20electronic%20substrates</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE.2015.7247979" target="_blank" >10.1109/ISSE.2015.7247979</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Comparison of the surface properties of power electronic substrates

Popis výsledku v původním jazyce

This paper deals with thick film copper technology (TFC) and its comparison with other power electronic substrates such as a printed silver or direct bonded copper (DBC) on alumina substrates. The research activities were concentrated on surface properties of power substrates and its solderability. The solderability of thick film copper is comparable with other power electronic substrates such as DBC, but it is necessary to ensure proper firing condition or remove oxides from the surface after firing and use a proper flux. The main advantages of thick film copper in comparison with common power electronic substrates are a high resolution of conductive pattern, higher reliability at thermal cycling and a possibility to create a different local thicknessof copper layer on substrate. Maximal thickness of copper layer can reach 300 ?m.

Název v anglickém jazyce

Comparison of the surface properties of power electronic substrates

Popis výsledku anglicky

This paper deals with thick film copper technology (TFC) and its comparison with other power electronic substrates such as a printed silver or direct bonded copper (DBC) on alumina substrates. The research activities were concentrated on surface properties of power substrates and its solderability. The solderability of thick film copper is comparable with other power electronic substrates such as DBC, but it is necessary to ensure proper firing condition or remove oxides from the surface after firing and use a proper flux. The main advantages of thick film copper in comparison with common power electronic substrates are a high resolution of conductive pattern, higher reliability at thermal cycling and a possibility to create a different local thicknessof copper layer on substrate. Maximal thickness of copper layer can reach 300 ?m.

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

Výsledek vznikl pri realizaci vícero projektů. Více informací v záložce Projekty.

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2015

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Proceedings of the 2015 38th International Spring Seminar on Electronics Technology (ISSE 2015)

ISBN

978-1-4799-8860-0

ISSN

2161-2528

e-ISSN

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Počet stran výsledku

5

Strana od-do

1-5

Název nakladatele

IEEE

Místo vydání

Piscataway

Místo konání akce

Eger, Maďarsko

Datum konání akce

6. 5. 2015

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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