Influence of electrically conductive adhesive quantity on insulation distance and shear strength of glued joints

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F16%3A43928892" target="_blank" >RIV/49777513:23220/16:43928892 - isvavai.cz</a>

Výsledek na webu

<a href="http://ieeexplore.ieee.org/document/7563175/" target="_blank" >http://ieeexplore.ieee.org/document/7563175/</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE.2016.7563175" target="_blank" >10.1109/ISSE.2016.7563175</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Influence of electrically conductive adhesive quantity on insulation distance and shear strength of glued joints

Popis výsledku v původním jazyce

This article deals with the impact of electrically conductive adhesive quantity on the insulation distance and shear strength of joints glued by adhesives "MG 8331S" and Hysol CA3150" on rigid substrates FR-4. These joints were formed by adhesive bonding of chip resistors 0805. Nine different shapes of apertures in stencil were used for this experiment. These differences have an effect on the quantity of conductive adhesives which is used on the samples and an effect on the insulation distance between pads. Samples were measured after the curing process by using a shear strength test applied by the device LabTest 3.030. This article presents the effects of different shapes apertures in stencil and different quantities of adhesives on the mechanical strength of the joint and the insulation distance between pads.

Název v anglickém jazyce

Influence of electrically conductive adhesive quantity on insulation distance and shear strength of glued joints

Popis výsledku anglicky

This article deals with the impact of electrically conductive adhesive quantity on the insulation distance and shear strength of joints glued by adhesives "MG 8331S" and Hysol CA3150" on rigid substrates FR-4. These joints were formed by adhesive bonding of chip resistors 0805. Nine different shapes of apertures in stencil were used for this experiment. These differences have an effect on the quantity of conductive adhesives which is used on the samples and an effect on the insulation distance between pads. Samples were measured after the curing process by using a shear strength test applied by the device LabTest 3.030. This article presents the effects of different shapes apertures in stencil and different quantities of adhesives on the mechanical strength of the joint and the insulation distance between pads.

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

<a href="/cs/project/LO1607" target="_blank" >LO1607: RICE – Nové technologie a koncepce pro inteligentní průmyslové systémy</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2016

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Proceedings of the International Spring Seminar of Electronics Technology (ISSE 2016)

ISBN

978-1-5090-1389-0

ISSN

—

e-ISSN

—

Počet stran výsledku

6

Strana od-do

134-139

Název nakladatele

IEEE

Místo vydání

Piscataway

Místo konání akce

Pilsen, Czech Republic

Datum konání akce

18. 5. 2016

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000387089800026