Shear strength of conductive adhesive joints on rigid and flexible substrates depending on adhesive quantity

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F16%3A43928949" target="_blank" >RIV/49777513:23220/16:43928949 - isvavai.cz</a>

Výsledek na webu

<a href="http://iris.elf.stuba.sk/cgi-bin/jeeec?act=pr&no=3_116" target="_blank" >http://iris.elf.stuba.sk/cgi-bin/jeeec?act=pr&no=3_116</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1515/jee-2016-0025" target="_blank" >10.1515/jee-2016-0025</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Shear strength of conductive adhesive joints on rigid and flexible substrates depending on adhesive quantity

Popis výsledku v původním jazyce

This article deals with the impact of electrically conductive adhesive quantity on the shear strength of joints glued by adhesives "EPO-TEK(R) H20S" and "MG8331S" on three types of substrates (FR-4, MELINEX(R)ST504, DuPontTM Pyralux(R)AC). These joints were made by gluing chip resistors 1206, 0805 and 0603, with two curing pro?les for each adhesive. Di?erent thicknesses of stencil and reductions in the size of the hole in stencils were used for this experiment. These di?erences have an e?ect on the quantity of conductive adhesives which must be used on the samples. Samples were measured after the curing process by using a shear strength test applied by the device LabTest 3.030. This article presents the e?ects of di?erent curing pro?les, various types of substrates, and di?erent quantities of adhesives on the mechanical strength of the joint.

Název v anglickém jazyce

Shear strength of conductive adhesive joints on rigid and flexible substrates depending on adhesive quantity

Popis výsledku anglicky

This article deals with the impact of electrically conductive adhesive quantity on the shear strength of joints glued by adhesives "EPO-TEK(R) H20S" and "MG8331S" on three types of substrates (FR-4, MELINEX(R)ST504, DuPontTM Pyralux(R)AC). These joints were made by gluing chip resistors 1206, 0805 and 0603, with two curing pro?les for each adhesive. Di?erent thicknesses of stencil and reductions in the size of the hole in stencils were used for this experiment. These di?erences have an e?ect on the quantity of conductive adhesives which must be used on the samples. Samples were measured after the curing process by using a shear strength test applied by the device LabTest 3.030. This article presents the e?ects of di?erent curing pro?les, various types of substrates, and di?erent quantities of adhesives on the mechanical strength of the joint.

Druh

J_x - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

—

Projekt

<a href="/cs/project/LO1607" target="_blank" >LO1607: RICE – Nové technologie a koncepce pro inteligentní průmyslové systémy</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2016

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Journal of Electrical Engineering

ISSN

1335-3632

e-ISSN

—

Svazek periodika

67

Číslo periodika v rámci svazku

3

Stát vydavatele periodika

SK - Slovenská republika

Počet stran výsledku

8

Strana od-do

177-184

Kód UT WoS článku

000385265800004

EID výsledku v databázi Scopus

2-s2.0-84978120249