Optimization of apertures shapes in stencil for ECA printing to connecting of SMD components on PCBs

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F19%3A43958055" target="_blank" >RIV/49777513:23220/19:43958055 - isvavai.cz</a>

Výsledek na webu

<a href="http://147.228.94.30/images/PDF/Rocnik2019/Cislo2_2019/r13c2c4.pdf" target="_blank" >http://147.228.94.30/images/PDF/Rocnik2019/Cislo2_2019/r13c2c4.pdf</a>

DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Optimization of apertures shapes in stencil for ECA printing to connecting of SMD components on PCBs

Popis výsledku v původním jazyce

This paper deals with the influence of different apertures shape in stencil on mechanical shear strength, electrical resistance and insulation distance. In the experiment, the SMD chip components 0805 were assembled on flexible substrate by electrically conductive adhesives (MG 8331S, CA 3150). Six different shapes of apertures in stencil were used for this experiment. These differences have an effect on the quantity of conductive adhesives which is used on the samples and an effect on the insulation distance between pads. The half of samples was measured directly (electrical resistance, mechanical strength and insulation distance) and second half of samples was submitted to the accelerated ageing test (85°C/85%RH/16hrs) and then tested the same way. The results shows that it is appropriate to choose other aperture shape in stencil than standard rectangular shape.

Název v anglickém jazyce

Optimization of apertures shapes in stencil for ECA printing to connecting of SMD components on PCBs

Popis výsledku anglicky

This paper deals with the influence of different apertures shape in stencil on mechanical shear strength, electrical resistance and insulation distance. In the experiment, the SMD chip components 0805 were assembled on flexible substrate by electrically conductive adhesives (MG 8331S, CA 3150). Six different shapes of apertures in stencil were used for this experiment. These differences have an effect on the quantity of conductive adhesives which is used on the samples and an effect on the insulation distance between pads. The half of samples was measured directly (electrical resistance, mechanical strength and insulation distance) and second half of samples was submitted to the accelerated ageing test (85°C/85%RH/16hrs) and then tested the same way. The results shows that it is appropriate to choose other aperture shape in stencil than standard rectangular shape.

Druh

J_ost - Ostatní články v recenzovaných periodicích

CEP obor

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OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

<a href="/cs/project/EF18_069%2F0009855" target="_blank" >EF18_069/0009855: Elektrotechnické technologie s vysokým podílem vestavěné inteligence</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2019

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Electroscope

ISSN

1802-4564

e-ISSN

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Svazek periodika

2019

Číslo periodika v rámci svazku

2

Stát vydavatele periodika

CZ - Česká republika

Počet stran výsledku

6

Strana od-do

1-6

Kód UT WoS článku

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EID výsledku v databázi Scopus

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