Stretch testing of SMD resistors contacted by a novel thermo-compression method on a textile ribbon

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F21%3A43962016" target="_blank" >RIV/49777513:23220/21:43962016 - isvavai.cz</a>

Výsledek na webu

<a href="https://ieeexplore.ieee.org/document/9467635" target="_blank" >https://ieeexplore.ieee.org/document/9467635</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE51996.2021.9467635" target="_blank" >10.1109/ISSE51996.2021.9467635</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Stretch testing of SMD resistors contacted by a novel thermo-compression method on a textile ribbon

Popis výsledku v původním jazyce

This paper is focused on the dynamic stretch testing of SMD chip resistors which were contacted on a textile conductive ribbon by a thermo-compression method. In this method, the plastic housing made from Acrylonitrile Butadiene Styrene (ABS) material with a cavity for SMD component is placed on the textile ribbon, melted and subsequently cooled under continuous pressure (variant 1). The electrical contact resistance can be decreased by applying SnBi solder paste on the conductive textile pads (variant 2) or by realizing SnBi bumps on the leads of the SMD component (variant 3). Low-temperature solder based on Bismuth material can be melted altogether with plastic housing in one step. The electrical contact resistance was measured right after the manufacturing and subsequently after every 2000 stretching cycles up to 12000 cycles.

Název v anglickém jazyce

Stretch testing of SMD resistors contacted by a novel thermo-compression method on a textile ribbon

Popis výsledku anglicky

This paper is focused on the dynamic stretch testing of SMD chip resistors which were contacted on a textile conductive ribbon by a thermo-compression method. In this method, the plastic housing made from Acrylonitrile Butadiene Styrene (ABS) material with a cavity for SMD component is placed on the textile ribbon, melted and subsequently cooled under continuous pressure (variant 1). The electrical contact resistance can be decreased by applying SnBi solder paste on the conductive textile pads (variant 2) or by realizing SnBi bumps on the leads of the SMD component (variant 3). Low-temperature solder based on Bismuth material can be melted altogether with plastic housing in one step. The electrical contact resistance was measured right after the manufacturing and subsequently after every 2000 stretching cycles up to 12000 cycles.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

<a href="/cs/project/FW03010077" target="_blank" >FW03010077: InTechTex - Inovativní technologie integrace a pouzdření elektronických prvků pro smart textilie odolávající extrémním podmínkám</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Rok uplatnění

2021

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2021 44th International Spring Seminar on Electronics Technology : /proceedings/

ISBN

978-1-66541-477-7

ISSN

—

e-ISSN

2161-2536

Počet stran výsledku

5

Strana od-do

1-5

Název nakladatele

IEEE

Místo vydání

Piscaway

Místo konání akce

web-basec Conference, Bautzen, Germany

Datum konání akce

5. 5. 2021

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000853459100063