Properties verification of improved lead-free solder alloys

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F21%3A43962021" target="_blank" >RIV/49777513:23220/21:43962021 - isvavai.cz</a>

Výsledek na webu

<a href="https://ieeexplore.ieee.org/document/9467573" target="_blank" >https://ieeexplore.ieee.org/document/9467573</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE51996.2021.9467573" target="_blank" >10.1109/ISSE51996.2021.9467573</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Properties verification of improved lead-free solder alloys

Popis výsledku v původním jazyce

This article presents research focused on the reliability of soldered joints. The quality of solder joints is formed already during the soldering process. The first parameter that determines the quality of the connection is solderability. Good solderability is essential for the subsequent reliability of the joint. The second parameter, which affects reliability and is also determined during the soldering process, is the thickness of intermetallic compounds. However, this parameter is also affected by the operating conditions. It increases over time. These two parameters were selected for our experiment. The object of the experiment is to compare the standard lead-free solder alloy SAC 305 with solders that have been enriched with cobalt or germanium. The comparison and full results from measurement will be discussed in the full paper.

Název v anglickém jazyce

Properties verification of improved lead-free solder alloys

Popis výsledku anglicky

This article presents research focused on the reliability of soldered joints. The quality of solder joints is formed already during the soldering process. The first parameter that determines the quality of the connection is solderability. Good solderability is essential for the subsequent reliability of the joint. The second parameter, which affects reliability and is also determined during the soldering process, is the thickness of intermetallic compounds. However, this parameter is also affected by the operating conditions. It increases over time. These two parameters were selected for our experiment. The object of the experiment is to compare the standard lead-free solder alloy SAC 305 with solders that have been enriched with cobalt or germanium. The comparison and full results from measurement will be discussed in the full paper.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

<a href="/cs/project/EF18_069%2F0009855" target="_blank" >EF18_069/0009855: Elektrotechnické technologie s vysokým podílem vestavěné inteligence</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2021

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2021 44th International Spring Seminar on Electronics Technology : /proceedings/

ISBN

978-1-66541-477-7

ISSN

—

e-ISSN

2161-2536

Počet stran výsledku

5

Strana od-do

1-5

Název nakladatele

IEEE

Místo vydání

Piscaway

Místo konání akce

web-basec Conference, Bautzen, Germany

Datum konání akce

5. 5. 2021

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000853459100027