Study of low-temperature interconnection techniques for instant assembly of electronics on stretchable e-textile ribbons

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F22%3A43965215" target="_blank" >RIV/49777513:23220/22:43965215 - isvavai.cz</a>

Výsledek na webu

<a href="https://journals.sagepub.com/doi/10.1177/00405175221084737" target="_blank" >https://journals.sagepub.com/doi/10.1177/00405175221084737</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1177/00405175221084737" target="_blank" >10.1177/00405175221084737</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Study of low-temperature interconnection techniques for instant assembly of electronics on stretchable e-textile ribbons

Popis výsledku v původním jazyce

This article addresses the research and development of a reliable interconnection technique for mounting surface mounted device components onto newly developed conductive stretchable textile ribbons. The alternative nonconductive adhesive bonding in which electrical contact is realized only by mechanical pressure and fixed by an adhesive and the conventional soldering technique were selected for examination. Assessment of the performance of these techniques and their usability for interconnecting components on conductive textile ribbons was also our research goal. Reliability tests of the electrical and mechanical properties of realized interconnections (dry heat, damp heat, washing, electrical current load, jerk, and stretch tests) were realized. The results show that the nonconductive adhesive technique results in good mechanical properties and acceptable median electrical resistance of less than 2 omega even after 90 washing cycles. It is also very gentle and fully compatible with textile production due to the maximal processing temperature lower than 70 degrees C, without the risk of short circuit occurrence. This technique is suitable for sensors, illumination or data transfer applications. While soldering results in excellent median electrical resistance of less than 20 m omega, it is more complex and costly. Moreover, there is a risk of short circuits as well as of textile damage by the high thermal load over 150 degrees C. Soldering is more suitable for power supply applications or heating. The above-mentioned results were also confirmed in a decision analysis with pairwise comparisons, involving company representatives considering introducing the above-mentioned interconnection techniques into their production. The nonconductive adhesive technique was evaluated as 15% better in overall decision analysis than the low-temperature soldering.

Název v anglickém jazyce

Study of low-temperature interconnection techniques for instant assembly of electronics on stretchable e-textile ribbons

Popis výsledku anglicky

This article addresses the research and development of a reliable interconnection technique for mounting surface mounted device components onto newly developed conductive stretchable textile ribbons. The alternative nonconductive adhesive bonding in which electrical contact is realized only by mechanical pressure and fixed by an adhesive and the conventional soldering technique were selected for examination. Assessment of the performance of these techniques and their usability for interconnecting components on conductive textile ribbons was also our research goal. Reliability tests of the electrical and mechanical properties of realized interconnections (dry heat, damp heat, washing, electrical current load, jerk, and stretch tests) were realized. The results show that the nonconductive adhesive technique results in good mechanical properties and acceptable median electrical resistance of less than 2 omega even after 90 washing cycles. It is also very gentle and fully compatible with textile production due to the maximal processing temperature lower than 70 degrees C, without the risk of short circuit occurrence. This technique is suitable for sensors, illumination or data transfer applications. While soldering results in excellent median electrical resistance of less than 20 m omega, it is more complex and costly. Moreover, there is a risk of short circuits as well as of textile damage by the high thermal load over 150 degrees C. Soldering is more suitable for power supply applications or heating. The above-mentioned results were also confirmed in a decision analysis with pairwise comparisons, involving company representatives considering introducing the above-mentioned interconnection techniques into their production. The nonconductive adhesive technique was evaluated as 15% better in overall decision analysis than the low-temperature soldering.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

<a href="/cs/project/EF18_069%2F0009855" target="_blank" >EF18_069/0009855: Elektrotechnické technologie s vysokým podílem vestavěné inteligence</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2022

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

TEXTILE RESEARCH JOURNAL

ISSN

0040-5175

e-ISSN

1746-7748

Svazek periodika

92

Číslo periodika v rámci svazku

21-22

Stát vydavatele periodika

GB - Spojené království Velké Británie a Severního Irska

Počet stran výsledku

19

Strana od-do

4269-4287

Kód UT WoS článku

000806206700001

EID výsledku v databázi Scopus

2-s2.0-85131350026