Reliability Testing of Recycled SMD Components Reused in E-Textiles after Ageing by Washing Cycles

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F23%3A43970521" target="_blank" >RIV/49777513:23220/23:43970521 - isvavai.cz</a>

Výsledek na webu

<a href="https://ieeexplore.ieee.org/document/10418384" target="_blank" >https://ieeexplore.ieee.org/document/10418384</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.23919/EMPC55870.2023.10418384" target="_blank" >10.23919/EMPC55870.2023.10418384</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Reliability Testing of Recycled SMD Components Reused in E-Textiles after Ageing by Washing Cycles

Popis výsledku v původním jazyce

This paper presents a method for recycling and reusing SMD chip components in e-textiles using a special contacting technique. The method involves using a UV-curable, non-conductive acrylic adhesive to connect SMD components onto electrically conductive textile stretchable ribbons. At the end of the product’s life-cycle, the components are removed from the ribbon and reused to manufacture new products. The recycling procedure involves several steps, including disassembly, inspection, cleaning, repair, and reassembly of components. The results of an experiment testing the electrical resistance of new and reused components after washing and drying cycles showed that electrical resistance of reused joints did not significantly deteriorate compared to new joints. The reused components maintain their functionality and performance, suffering no significant impairment. They perform comparably to new components, even after repeated washing and drying cycles. The method offers several benefits, including conservation of raw materials, minimization of waste,and reduction of production costs. It can also help mitigate component shortages. However, it is found that the suitability of this remanufacturing method varies with different types of components. Certain component types may be more susceptible to damage or even unsuitable for this method. The method is particularly beneficial for higher-value or components experiencing market shortages, demonstrating its potential to address urgent industry challenges while contributing to environmental sustainability.

Název v anglickém jazyce

Reliability Testing of Recycled SMD Components Reused in E-Textiles after Ageing by Washing Cycles

Popis výsledku anglicky

This paper presents a method for recycling and reusing SMD chip components in e-textiles using a special contacting technique. The method involves using a UV-curable, non-conductive acrylic adhesive to connect SMD components onto electrically conductive textile stretchable ribbons. At the end of the product’s life-cycle, the components are removed from the ribbon and reused to manufacture new products. The recycling procedure involves several steps, including disassembly, inspection, cleaning, repair, and reassembly of components. The results of an experiment testing the electrical resistance of new and reused components after washing and drying cycles showed that electrical resistance of reused joints did not significantly deteriorate compared to new joints. The reused components maintain their functionality and performance, suffering no significant impairment. They perform comparably to new components, even after repeated washing and drying cycles. The method offers several benefits, including conservation of raw materials, minimization of waste,and reduction of production costs. It can also help mitigate component shortages. However, it is found that the suitability of this remanufacturing method varies with different types of components. Certain component types may be more susceptible to damage or even unsuitable for this method. The method is particularly beneficial for higher-value or components experiencing market shortages, demonstrating its potential to address urgent industry challenges while contributing to environmental sustainability.

Druh

D - Stať ve sborníku

CEP obor

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OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

<a href="/cs/project/TN02000067" target="_blank" >TN02000067: Nové směry v elektronice pro průmysl 4.0 a medicínu 4.0</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Rok uplatnění

2023

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2023 24th European Microelectronics and Packaging Conference &amp; Exhibition (EMPC)

ISBN

978-0-9568086-9-1

ISSN

—

e-ISSN

—

Počet stran výsledku

5

Strana od-do

—

Název nakladatele

IEEE

Místo vydání

Piscataway

Místo konání akce

Cambridge, UK

Datum konání akce

11. 9. 2023

Typ akce podle státní příslušnosti

EUR - Evropská akce

Kód UT WoS článku

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