SMD Components Recycling Procedure for Reuse in E-Textiles with Risk Analysis

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F24%3A43969179" target="_blank" >RIV/49777513:23220/24:43969179 - isvavai.cz</a>

Výsledek na webu

<a href="https://link.springer.com/chapter/10.1007/978-3-031-38165-2_114" target="_blank" >https://link.springer.com/chapter/10.1007/978-3-031-38165-2_114</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1007/978-3-031-38165-2_114" target="_blank" >10.1007/978-3-031-38165-2_114</a>

Jazyk výsledku

angličtina

Název v původním jazyce

SMD Components Recycling Procedure for Reuse in E-Textiles with Risk Analysis

Popis výsledku v původním jazyce

This paper deals remanufacturing method for the reuse of adhesive bonded SMD components on stretchable textile ribbons for integration in e-textiles and its risk analysis. Nowadays, e-waste is an increasing problem in the world, and reducing this problem by using circular economy principles and reusing components is beneficial. In our research, the samples were submitted for accelerated ageing by dry heat and their quality was evaluated by the electrical resistance measurement. The recycling procedure was realized four times, and the mentioned risk analysis was realized before and after the experiment. The two main goals of our research were determined. The first goal was to demonstrate the applicability of our recycling procedure and the quality of samples with reused components after accelerated climatic ageing by dry heat. The second goal was to create and verify the risk analysis of our method and identify actions to mitigate the high and very high risks. The experiment showed that our recycling method is applicable several times without decreasing product quality. The results also present that reused samples are functional like new even after samples dry heat ageing. The risk analysis after the experiment showed seven high risks, which is necessary to solve primarily. These risk factors and actions to mitigate them are described in the paper.

Název v anglickém jazyce

SMD Components Recycling Procedure for Reuse in E-Textiles with Risk Analysis

Popis výsledku anglicky

This paper deals remanufacturing method for the reuse of adhesive bonded SMD components on stretchable textile ribbons for integration in e-textiles and its risk analysis. Nowadays, e-waste is an increasing problem in the world, and reducing this problem by using circular economy principles and reusing components is beneficial. In our research, the samples were submitted for accelerated ageing by dry heat and their quality was evaluated by the electrical resistance measurement. The recycling procedure was realized four times, and the mentioned risk analysis was realized before and after the experiment. The two main goals of our research were determined. The first goal was to demonstrate the applicability of our recycling procedure and the quality of samples with reused components after accelerated climatic ageing by dry heat. The second goal was to create and verify the risk analysis of our method and identify actions to mitigate the high and very high risks. The experiment showed that our recycling method is applicable several times without decreasing product quality. The results also present that reused samples are functional like new even after samples dry heat ageing. The risk analysis after the experiment showed seven high risks, which is necessary to solve primarily. These risk factors and actions to mitigate them are described in the paper.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2024

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Proceedings of FAIM 2023

ISBN

978-3-031-38164-5

ISSN

2195-4356

e-ISSN

2195-4364

Počet stran výsledku

11

Strana od-do

988-998

Název nakladatele

Springer Cham

Místo vydání

Cham

Místo konání akce

Porto, Portugal

Datum konání akce

18. 6. 2023

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

—