Recycling SMD Components for E-Textile Fabrication: A Salt Spray Ageing Study

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F24%3A43973305" target="_blank" >RIV/49777513:23220/24:43973305 - isvavai.cz</a>

Výsledek na webu

<a href="https://ieeexplore.ieee.org/document/10712140" target="_blank" >https://ieeexplore.ieee.org/document/10712140</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ESTC60143.2024.10712140" target="_blank" >10.1109/ESTC60143.2024.10712140</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Recycling SMD Components for E-Textile Fabrication: A Salt Spray Ageing Study

Popis výsledku v původním jazyce

In an era where electronic waste is a growing concern, this paper introduces a groundbreaking recycling and reuse methodology for SMD chip components in e-textiles, promising a sustainable future for the electronics industry. Our innovative technique harnesses a UV-curable acrylic adhesive to conductively affix SMD components onto the electrically conductive paths in the textile stretchable ribbons. In the method, the SMD component is pressed onto the conductive paths and fixed in the direct intimate contact with the mentioned adhesive. These joints can be easily detached at the end of their lifecycle. This process not only conserves raw materials and minimizes waste but also significantly cuts production costs. Through realized experimentation, we demonstrate that the electrical resistance of reused joints remains stable, showing no substantial degradation when compared to new joints, even after salt spray ageing. This finding confirms that the performance of reused components is on par with new ones (at least when used twice), thus ensuring reliability in practical applications. While the method&apos;s applicability varies across different component types, it is advantageous, particularly for high-value parts or those in short supply. Engage with our full article to explore how this technique can improve component lifecycle management and pave the way for a more sustainable electronics landscape.

Název v anglickém jazyce

Recycling SMD Components for E-Textile Fabrication: A Salt Spray Ageing Study

Popis výsledku anglicky

In an era where electronic waste is a growing concern, this paper introduces a groundbreaking recycling and reuse methodology for SMD chip components in e-textiles, promising a sustainable future for the electronics industry. Our innovative technique harnesses a UV-curable acrylic adhesive to conductively affix SMD components onto the electrically conductive paths in the textile stretchable ribbons. In the method, the SMD component is pressed onto the conductive paths and fixed in the direct intimate contact with the mentioned adhesive. These joints can be easily detached at the end of their lifecycle. This process not only conserves raw materials and minimizes waste but also significantly cuts production costs. Through realized experimentation, we demonstrate that the electrical resistance of reused joints remains stable, showing no substantial degradation when compared to new joints, even after salt spray ageing. This finding confirms that the performance of reused components is on par with new ones (at least when used twice), thus ensuring reliability in practical applications. While the method&apos;s applicability varies across different component types, it is advantageous, particularly for high-value parts or those in short supply. Engage with our full article to explore how this technique can improve component lifecycle management and pave the way for a more sustainable electronics landscape.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2024

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)

ISBN

979-8-3503-9036-0

ISSN

2687-9700

e-ISSN

2687-9727

Počet stran výsledku

5

Strana od-do

—

Název nakladatele

IEEE

Místo vydání

Piscataway

Místo konání akce

Berlín, Germany

Datum konání akce

11. 9. 2024

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

001340802800144