Investigation of cooling capability of ceramic substrates for power electronics applications

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F24%3A43971893" target="_blank" >RIV/49777513:23220/24:43971893 - isvavai.cz</a>

Výsledek na webu

<a href="https://www.sciencedirect.com/science/article/pii/S1359431124007786" target="_blank" >https://www.sciencedirect.com/science/article/pii/S1359431124007786</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1016/j.applthermaleng.2024.123110" target="_blank" >10.1016/j.applthermaleng.2024.123110</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Investigation of cooling capability of ceramic substrates for power electronics applications

Popis výsledku v původním jazyce

This study investigates the cooling capability of ceramic substrates, which are commonly used in power electronics. Ceramic substrates are pivotal in thermal management because they address the challenges posed by the concurrent trends of miniaturisation and power enhancement in power electronics. Therefore, a detailed numerical study of the cooling capabilities of Al2O3 and AlN substrates with various thicknesses from 0.05 mm to 3 mm in a model configuration with defined liquid cooling is conducted. This model configuration represents a commonly used stack-up for real power electronic modules. The results of the numerical study are verified through experimental measurements. It was demonstrated that for low substrate thicknesses (0.3–0.6 mm), similar cooling capabilities can be achieved by a combination of more efficiently cooling, less thermally conductive, and less expensive substrate. However, AlN is highly efficient for cooling in applications requiring substrates with thicknesses greater than 1.0 mm. The present study proved that increasing the thickness of the AlN substrate has a negligible effect on cooling efficiency. Based on the results of the numerical study, which is verified by experimental measurements, it is possible to design the optimal thickness of the ceramic substrate, flow rate of the cooling medium, and material of the ceramic substrate to achieve the required power dissipation from the substrate without exceeding the maximum defined operating temperature.

Název v anglickém jazyce

Investigation of cooling capability of ceramic substrates for power electronics applications

Popis výsledku anglicky

This study investigates the cooling capability of ceramic substrates, which are commonly used in power electronics. Ceramic substrates are pivotal in thermal management because they address the challenges posed by the concurrent trends of miniaturisation and power enhancement in power electronics. Therefore, a detailed numerical study of the cooling capabilities of Al2O3 and AlN substrates with various thicknesses from 0.05 mm to 3 mm in a model configuration with defined liquid cooling is conducted. This model configuration represents a commonly used stack-up for real power electronic modules. The results of the numerical study are verified through experimental measurements. It was demonstrated that for low substrate thicknesses (0.3–0.6 mm), similar cooling capabilities can be achieved by a combination of more efficiently cooling, less thermally conductive, and less expensive substrate. However, AlN is highly efficient for cooling in applications requiring substrates with thicknesses greater than 1.0 mm. The present study proved that increasing the thickness of the AlN substrate has a negligible effect on cooling efficiency. Based on the results of the numerical study, which is verified by experimental measurements, it is possible to design the optimal thickness of the ceramic substrate, flow rate of the cooling medium, and material of the ceramic substrate to achieve the required power dissipation from the substrate without exceeding the maximum defined operating temperature.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

<a href="/cs/project/TN02000067" target="_blank" >TN02000067: Nové směry v elektronice pro průmysl 4.0 a medicínu 4.0</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Rok uplatnění

2024

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Applied Thermal Engineering

ISSN

1359-4311

e-ISSN

1873-5606

Svazek periodika

247

Číslo periodika v rámci svazku

June 2024

Stát vydavatele periodika

GB - Spojené království Velké Británie a Severního Irska

Počet stran výsledku

10

Strana od-do

—

Kód UT WoS článku

001225595100001

EID výsledku v databázi Scopus

2-s2.0-85189754467