An Overview of the Thick Film Copper Technology for Power Electronics

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F24%3A43973306" target="_blank" >RIV/49777513:23220/24:43973306 - isvavai.cz</a>

Výsledek na webu

<a href="https://ieeexplore.ieee.org/document/10712090" target="_blank" >https://ieeexplore.ieee.org/document/10712090</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ESTC60143.2024.10712090" target="_blank" >10.1109/ESTC60143.2024.10712090</a>

Jazyk výsledku

angličtina

Název v původním jazyce

An Overview of the Thick Film Copper Technology for Power Electronics

Popis výsledku v původním jazyce

This paper is focused on thick film copper technology which is used for power electronic substrate manufacturing. This technology is based on the printing of copper pastes on ceramic substrates and can be used as an alternative solution to conventional metallization techniques for the realization of power electronic substrates. Many experiments regarding the optimization and verification of electrical and mechanical parameters of single-layer and multilayer copper films on Al2O3 and AlN substrates were performed. This paper contains a description of experiments and achieved electrical and mechanical parameters of single-layer or multilayer copper structures such as adhesion, electrical and thermal conductivity, resistivity, solderability and density etc. The paper also describes the interaction between copper films and Al2O3 or AlN substrates which has an influence on the electrical parameters of the whole substrate and also includes design rules for both single and multilayer copper to help properly design the final power substrate.

Název v anglickém jazyce

An Overview of the Thick Film Copper Technology for Power Electronics

Popis výsledku anglicky

This paper is focused on thick film copper technology which is used for power electronic substrate manufacturing. This technology is based on the printing of copper pastes on ceramic substrates and can be used as an alternative solution to conventional metallization techniques for the realization of power electronic substrates. Many experiments regarding the optimization and verification of electrical and mechanical parameters of single-layer and multilayer copper films on Al2O3 and AlN substrates were performed. This paper contains a description of experiments and achieved electrical and mechanical parameters of single-layer or multilayer copper structures such as adhesion, electrical and thermal conductivity, resistivity, solderability and density etc. The paper also describes the interaction between copper films and Al2O3 or AlN substrates which has an influence on the electrical parameters of the whole substrate and also includes design rules for both single and multilayer copper to help properly design the final power substrate.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

<a href="/cs/project/FW10010062" target="_blank" >FW10010062: Chytré vysokonapěťové moduly vyráběné aditivními technologiemi - SHAMAN</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Rok uplatnění

2024

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)

ISBN

979-8-3503-9036-0

ISSN

2687-9700

e-ISSN

2687-9727

Počet stran výsledku

7

Strana od-do

—

Název nakladatele

IEEE

Místo vydání

Piscataway

Místo konání akce

Berlín, Germany

Datum konání akce

11. 9. 2024

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

001340802800094