Si ohmic contacts on N-type SiC studied by XPS
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F60461373%3A22310%2F13%3A43895685" target="_blank" >RIV/60461373:22310/13:43895685 - isvavai.cz</a>
Nalezeny alternativní kódy
RIV/60461373:22810/13:43895685
Výsledek na webu
<a href="http://dx.doi.org/10.1016/j.mee.2012.12.019" target="_blank" >http://dx.doi.org/10.1016/j.mee.2012.12.019</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1016/j.mee.2012.12.019" target="_blank" >10.1016/j.mee.2012.12.019</a>
Alternativní jazyky
Jazyk výsledku
angličtina
Název v původním jazyce
Si ohmic contacts on N-type SiC studied by XPS
Popis výsledku v původním jazyce
Si ohmic contacts on N-type 4H- and 6H-SiC with contact resistivity comparable with Ni metallizations were prepared. After etching-off of the Si contacts and deposition of new, unannealed ones, good electrical parameters of the original contacts remain preserved. Such unannealed secondary contacts were already successfully created with original Ni or Ni silicide metallizations. An advantage offered by the secondary contacts prepared after the original Si contacts is that they are prepared on a high-quality SiC surface as the original Si does not react with SiC. XPS and AFM analyses were carried out. Under the original Si contacts when they are etched-off there is observed a shift of Si and C peaks to higher binding energies in comparison with a clean,bare SiC surface. After less than 2 nm of the surface layer is sputtered-off the shift disappears. We suggest that preserved electrical parameters after the etching-off of the Si contacts stem from a SiC surface modification.
Název v anglickém jazyce
Si ohmic contacts on N-type SiC studied by XPS
Popis výsledku anglicky
Si ohmic contacts on N-type 4H- and 6H-SiC with contact resistivity comparable with Ni metallizations were prepared. After etching-off of the Si contacts and deposition of new, unannealed ones, good electrical parameters of the original contacts remain preserved. Such unannealed secondary contacts were already successfully created with original Ni or Ni silicide metallizations. An advantage offered by the secondary contacts prepared after the original Si contacts is that they are prepared on a high-quality SiC surface as the original Si does not react with SiC. XPS and AFM analyses were carried out. Under the original Si contacts when they are etched-off there is observed a shift of Si and C peaks to higher binding energies in comparison with a clean,bare SiC surface. After less than 2 nm of the surface layer is sputtered-off the shift disappears. We suggest that preserved electrical parameters after the etching-off of the Si contacts stem from a SiC surface modification.
Klasifikace
Druh
J<sub>x</sub> - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)
CEP obor
CA - Anorganická chemie
OECD FORD obor
—
Návaznosti výsledku
Projekt
<a href="/cs/project/GAP108%2F11%2F0894" target="_blank" >GAP108/11/0894: Růst a zpracování gafenových vrstev na karbidu křemíku</a><br>
Návaznosti
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)
Ostatní
Rok uplatnění
2013
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Údaje specifické pro druh výsledku
Název periodika
Microelectronic Engineering
ISSN
0167-9317
e-ISSN
—
Svazek periodika
106
Číslo periodika v rámci svazku
JUN 2013
Stát vydavatele periodika
NL - Nizozemsko
Počet stran výsledku
7
Strana od-do
132-138
Kód UT WoS článku
000319545500026
EID výsledku v databázi Scopus
—