Joining low temperature co-fired ceramics, Al2O3 and SiC substrates for higher operating temperature application

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F60461373%3A22310%2F17%3A43914873" target="_blank" >RIV/60461373:22310/17:43914873 - isvavai.cz</a>

Výsledek na webu

<a href="http://dx.doi.org/10.4028/www.scientific.net/SSP.258.631" target="_blank" >http://dx.doi.org/10.4028/www.scientific.net/SSP.258.631</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.4028/www.scientific.net/SSP.258.631" target="_blank" >10.4028/www.scientific.net/SSP.258.631</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Joining low temperature co-fired ceramics, Al2O3 and SiC substrates for higher operating temperature application

Popis výsledku v původním jazyce

The article deals with forming solid joints of Low Temperature Co-fired Ceramic with Alumina or Silicon Carbide chips. The aim of this study is to find material of standard thick film layer process, which would be useful for electronic chip packages designed for higher operating temperatures (from 150 up to 800 °C). Heraeus Hera Lock 2000 Low Temperature Co-fired Ceramics (LTCC) was chosen, because of its nearly zero shrinkage during firing. Also other LTCC types were used to comparison of results. Conductive and isolating thick film pastes are used for joining. Temperature cycling of samples was applied. Strength of cycled samples was investigated by mechanical shear tests. The structure of microsection of joints was analyzed using optical and scanning electron microscope. The results show that thick film pastes are usable for joining above mentioned materials in specific temperature range.

Název v anglickém jazyce

Joining low temperature co-fired ceramics, Al2O3 and SiC substrates for higher operating temperature application

Popis výsledku anglicky

The article deals with forming solid joints of Low Temperature Co-fired Ceramic with Alumina or Silicon Carbide chips. The aim of this study is to find material of standard thick film layer process, which would be useful for electronic chip packages designed for higher operating temperatures (from 150 up to 800 °C). Heraeus Hera Lock 2000 Low Temperature Co-fired Ceramics (LTCC) was chosen, because of its nearly zero shrinkage during firing. Also other LTCC types were used to comparison of results. Conductive and isolating thick film pastes are used for joining. Temperature cycling of samples was applied. Strength of cycled samples was investigated by mechanical shear tests. The structure of microsection of joints was analyzed using optical and scanning electron microscope. The results show that thick film pastes are usable for joining above mentioned materials in specific temperature range.

Druh

J_SC - Článek v periodiku v databázi SCOPUS

CEP obor

—

OECD FORD obor

20501 - Materials engineering

Projekt

—

Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2017

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Solid State Phenomena

ISSN

1662-9779

e-ISSN

—

Svazek periodika

258

Číslo periodika v rámci svazku

2017

Stát vydavatele periodika

CH - Švýcarská konfederace

Počet stran výsledku

4

Strana od-do

631-634

Kód UT WoS článku

—

EID výsledku v databázi Scopus

2-s2.0-85009727187