Fabrication and application of stainless steel stamps for the preparation of microfluidic devices

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F60461373%3A22340%2F14%3A43897991" target="_blank" >RIV/60461373:22340/14:43897991 - isvavai.cz</a>

Výsledek na webu

<a href="http://dx.doi.org/10.1016/j.mee.2014.04.009" target="_blank" >http://dx.doi.org/10.1016/j.mee.2014.04.009</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1016/j.mee.2014.04.009" target="_blank" >10.1016/j.mee.2014.04.009</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Fabrication and application of stainless steel stamps for the preparation of microfluidic devices

Popis výsledku v původním jazyce

The use of an electrochemical polishing process to manufacture stainless steel stamps often gives rise to problems: there is a significant release of gas bubbles that can cause the photoresist mask to peel off. In this paper, a new procedure for the manufacture of stainless steel stamps is presented based on a combination of UV-lithography, gold electroplating, and electropolishing techniques. First, the pattern of the stamp is transferred to a photoresist layer by UV-lithography. The pattern in the photoresist is then filled in with a thin layer of gold formed by electroplating. The photoresist is then removed and the substrate etched in an electropolishing bath, with the gold layer serving as an etching mask. The steel stamps were repeatedly tested for the hot embossing of the polymethylmethacrylate substrate. The imprints were used for the preparation of functional microchips to test their functionality, the chips consisting of two polymethylmethacrylate plates: a plate with microch

Název v anglickém jazyce

Fabrication and application of stainless steel stamps for the preparation of microfluidic devices

Popis výsledku anglicky

The use of an electrochemical polishing process to manufacture stainless steel stamps often gives rise to problems: there is a significant release of gas bubbles that can cause the photoresist mask to peel off. In this paper, a new procedure for the manufacture of stainless steel stamps is presented based on a combination of UV-lithography, gold electroplating, and electropolishing techniques. First, the pattern of the stamp is transferred to a photoresist layer by UV-lithography. The pattern in the photoresist is then filled in with a thin layer of gold formed by electroplating. The photoresist is then removed and the substrate etched in an electropolishing bath, with the gold layer serving as an etching mask. The steel stamps were repeatedly tested for the hot embossing of the polymethylmethacrylate substrate. The imprints were used for the preparation of functional microchips to test their functionality, the chips consisting of two polymethylmethacrylate plates: a plate with microch

Druh

J_x - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)

CEP obor

CI - Průmyslová chemie a chemické inženýrství

OECD FORD obor

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Projekt

<a href="/cs/project/TA01010353" target="_blank" >TA01010353: Recyklace, separace a rafinace vzácných kovů (indium, gallium, ...) z druhotných surovin elektronického a fotovoltaického průmyslu</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Rok uplatnění

2014

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Microelectronic Engineering

ISSN

0167-9317

e-ISSN

—

Svazek periodika

125

Číslo periodika v rámci svazku

NEUVEDEN

Stát vydavatele periodika

NL - Nizozemsko

Počet stran výsledku

6

Strana od-do

83-88

Kód UT WoS článku

000338611700017

EID výsledku v databázi Scopus

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