Wettability in lead-free soldering: effect of plasma treatment in dependence on flux type

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F61389013%3A_____%2F24%3A00586489" target="_blank" >RIV/61389013:_____/24:00586489 - isvavai.cz</a>

Nalezeny alternativní kódy

RIV/68407700:21230/24:00375448

Výsledek na webu

<a href="https://www.sciencedirect.com/science/article/pii/S0169433224011607?via%3Dihub" target="_blank" >https://www.sciencedirect.com/science/article/pii/S0169433224011607?via%3Dihub</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1016/j.apsusc.2024.160447" target="_blank" >10.1016/j.apsusc.2024.160447</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Wettability in lead-free soldering: effect of plasma treatment in dependence on flux type

Popis výsledku v původním jazyce

To enhance the solderability, highly active fluxes are commonly employed in lead-free soldering. However, there are industry-wide efforts to use less active fluxes to avoid possible issues associated with corrosion processes and minimize subsequent cleaning processes, thereby reducing potential environmentally harmful waste. Therefore, in this study, the effect of the plasma treatment (N2/H2 97:3) on the wettability of the soldered surface (copper connectors) was investigated. Wettability measurements were conducted using SAC305 solder alloy and six different fluxes. The wetting balance test revealed a significant improvement in wetting for all tested fluxes, regardless of their composition. On the other hand, non-wetting occurred when no flux was applied to the plasma-treated surface, attributed to a thin residual oxide layer detected by X-ray photoelectron spectroscopy. Thus, the plasma treatment of the surface supports the flux effect, which cannot be entirely omitted from the soldering process. However, incorporating plasma treatment in the soldering process allows for the use of much less active or even expired fluxes.

Název v anglickém jazyce

Wettability in lead-free soldering: effect of plasma treatment in dependence on flux type

Popis výsledku anglicky

To enhance the solderability, highly active fluxes are commonly employed in lead-free soldering. However, there are industry-wide efforts to use less active fluxes to avoid possible issues associated with corrosion processes and minimize subsequent cleaning processes, thereby reducing potential environmentally harmful waste. Therefore, in this study, the effect of the plasma treatment (N2/H2 97:3) on the wettability of the soldered surface (copper connectors) was investigated. Wettability measurements were conducted using SAC305 solder alloy and six different fluxes. The wetting balance test revealed a significant improvement in wetting for all tested fluxes, regardless of their composition. On the other hand, non-wetting occurred when no flux was applied to the plasma-treated surface, attributed to a thin residual oxide layer detected by X-ray photoelectron spectroscopy. Thus, the plasma treatment of the surface supports the flux effect, which cannot be entirely omitted from the soldering process. However, incorporating plasma treatment in the soldering process allows for the use of much less active or even expired fluxes.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

10404 - Polymer science

Projekt

—

Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2024

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Applied Surface Science

ISSN

0169-4332

e-ISSN

1873-5584

Svazek periodika

668

Číslo periodika v rámci svazku

30 September

Stát vydavatele periodika

NL - Nizozemsko

Počet stran výsledku

9

Strana od-do

160447

Kód UT WoS článku

001314269100001

EID výsledku v databázi Scopus

2-s2.0-85194874662