Propeties of Leadfree Solders and Electrically Conductive Adhesives Subjected to Climatic Tests

Kód výsledku v IS VaVaI

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Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Propeties of Leadfree Solders and Electrically Conductive Adhesives Subjected to Climatic Tests

Popis výsledku v původním jazyce

This paper presents an overview of climatic experiments attempting to simulate various combinations of operating conditions of electronic device. The main aim of the experiment was to expand our knowledge, which is currently relatively limited where it concerns modern technologies used in electronics. The speed of innovation in this field accelerated To gather knowledge about climatic impacts on reliability, a series of tests were conducted during the course of last two semesters. The specimens of two different electrically conductive adhesives and two lead-free solders, along with an ordinary Sn-Pb solder, were subjected to several types of climatic stress.

Název v anglickém jazyce

Propeties of Leadfree Solders and Electrically Conductive Adhesives Subjected to Climatic Tests

Popis výsledku anglicky

This paper presents an overview of climatic experiments attempting to simulate various combinations of operating conditions of electronic device. The main aim of the experiment was to expand our knowledge, which is currently relatively limited where it concerns modern technologies used in electronics. The speed of innovation in this field accelerated To gather knowledge about climatic impacts on reliability, a series of tests were conducted during the course of last two semesters. The specimens of two different electrically conductive adhesives and two lead-free solders, along with an ordinary Sn-Pb solder, were subjected to several types of climatic stress.

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

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Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2010

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Electronic Devices and Systems, IMAPS CS International Conference 2010 Proceedings

ISBN

978-80-214-4138-5

ISSN

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e-ISSN

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Počet stran výsledku

4

Strana od-do

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Název nakladatele

VUT v Brně, FEI

Místo vydání

Brno

Místo konání akce

Brno

Datum konání akce

1. 9. 2010

Typ akce podle státní příslušnosti

EUR - Evropská akce

Kód UT WoS článku

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