Investigation of Flicker Noise in Silicon Diodes under Reverse Bias
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F12%3A00190036" target="_blank" >RIV/68407700:21230/12:00190036 - isvavai.cz</a>
Výsledek na webu
<a href="http://dx.doi.org/10.1016/j.microrel.2011.10.021" target="_blank" >http://dx.doi.org/10.1016/j.microrel.2011.10.021</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1016/j.microrel.2011.10.021" target="_blank" >10.1016/j.microrel.2011.10.021</a>
Alternativní jazyky
Jazyk výsledku
angličtina
Název v původním jazyce
Investigation of Flicker Noise in Silicon Diodes under Reverse Bias
Popis výsledku v původním jazyce
This article analyses some connections between the reverse properties of silicon power diodes and their flicker noise under reverse bias conditions. It is shown that the presence of defects in the silicon surface near the pn-junction termination has a significant influence on both the reverse VA characteristics (RVAC) and the low-frequency power noise of diodes under reverse bias conditions. However, the inherent relationship between both effects becomes apparent only under special conditions and by theuse of sophisticated measurements. The article presents a simple physical model, describing the behaviour and effect of surface structural defects on the silicon surfaces in connection with the reverse and noise properties of the tested diodes. The model identifies and consequently performs the mutual relationships with respect to the physical nature of the investigated defects. The most important practical contribution of this article is to identify a simple way to reveal latent defect
Název v anglickém jazyce
Investigation of Flicker Noise in Silicon Diodes under Reverse Bias
Popis výsledku anglicky
This article analyses some connections between the reverse properties of silicon power diodes and their flicker noise under reverse bias conditions. It is shown that the presence of defects in the silicon surface near the pn-junction termination has a significant influence on both the reverse VA characteristics (RVAC) and the low-frequency power noise of diodes under reverse bias conditions. However, the inherent relationship between both effects becomes apparent only under special conditions and by theuse of sophisticated measurements. The article presents a simple physical model, describing the behaviour and effect of surface structural defects on the silicon surfaces in connection with the reverse and noise properties of the tested diodes. The model identifies and consequently performs the mutual relationships with respect to the physical nature of the investigated defects. The most important practical contribution of this article is to identify a simple way to reveal latent defect
Klasifikace
Druh
J<sub>x</sub> - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)
CEP obor
JA - Elektronika a optoelektronika, elektrotechnika
OECD FORD obor
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Návaznosti výsledku
Projekt
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Návaznosti
Z - Vyzkumny zamer (s odkazem do CEZ)
Ostatní
Rok uplatnění
2012
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Údaje specifické pro druh výsledku
Název periodika
Microelectronics Reliability
ISSN
0026-2714
e-ISSN
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Svazek periodika
52
Číslo periodika v rámci svazku
3
Stát vydavatele periodika
NL - Nizozemsko
Počet stran výsledku
6
Strana od-do
469-474
Kód UT WoS článku
000302045400003
EID výsledku v databázi Scopus
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