Degradation of Soldered Joints Made of Lead Free Alloys and its Influence on Mechanical Properties

Kód výsledku v IS VaVaI

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Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Degradation of Soldered Joints Made of Lead Free Alloys and its Influence on Mechanical Properties

Popis výsledku v původním jazyce

The paper presents results of monitoring internal structure of soldered joints, its degradation during elevated temperature treatment (150 °C, up to 3000 hrs.) and influence of those factors on shear strength of the joints. Internal structure of solder joints made of new lead free alloys Sn-0,7Cu, Sn-3,5Ag and Sn-3,7Ag-0,7Cu was observed immediately after reflow using RT analysis. Changes of internal structures of the joints after the ageing were monitored. The main focus was on the presence of intermetallic compounds (IMC) and their genesis after reflow and temperature treatment. Shear strength of soldered joint was measured and the influence of internal structure was discussed.

Název v anglickém jazyce

Degradation of Soldered Joints Made of Lead Free Alloys and its Influence on Mechanical Properties

Popis výsledku anglicky

The paper presents results of monitoring internal structure of soldered joints, its degradation during elevated temperature treatment (150 °C, up to 3000 hrs.) and influence of those factors on shear strength of the joints. Internal structure of solder joints made of new lead free alloys Sn-0,7Cu, Sn-3,5Ag and Sn-3,7Ag-0,7Cu was observed immediately after reflow using RT analysis. Changes of internal structures of the joints after the ageing were monitored. The main focus was on the presence of intermetallic compounds (IMC) and their genesis after reflow and temperature treatment. Shear strength of soldered joint was measured and the influence of internal structure was discussed.

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

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Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2012

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Proceedings of Electronic Devices and Systems EDS 2012

ISBN

978-80-214-4539-0

ISSN

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e-ISSN

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Počet stran výsledku

6

Strana od-do

196-201

Název nakladatele

VUT v Brně, FEKT

Místo vydání

Brno

Místo konání akce

Brno

Datum konání akce

28. 6. 2012

Typ akce podle státní příslušnosti

EUR - Evropská akce

Kód UT WoS článku

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