Influence of Intermetallic Compounds on RF Resistance of Joints Soldered with Lead Free Alloys
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F12%3A00199272" target="_blank" >RIV/68407700:21230/12:00199272 - isvavai.cz</a>
Výsledek na webu
<a href="http://www.radioeng.cz/fulltexts/2012/12_02_0573_0579.pdf" target="_blank" >http://www.radioeng.cz/fulltexts/2012/12_02_0573_0579.pdf</a>
DOI - Digital Object Identifier
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Alternativní jazyky
Jazyk výsledku
angličtina
Název v původním jazyce
Influence of Intermetallic Compounds on RF Resistance of Joints Soldered with Lead Free Alloys
Popis výsledku v původním jazyce
During soldering process intermetallic compounds as a reaction between solder and substrate are created. Physical properties of those compounds are different to properties of solder and substrate. The influence of intermetallic compounds (IMC) on radio frequency resistance of soldered joint has been identified. Tested solders were lead free Sn-1Cu, Sn-4Ag and Sn-3.8Ag-0.7Cu and lead containing Sn-37Pb (all in weight percent). Samples were annealed up to 3000 hours at 150 °C to accelerated growing of IMC. Radio frequency measuring method has been developed and is described. Influence of IMC on resistance of joint is growing with growing frequency because IMC with slightly different resistivity to base solder is creating barrier to current. Resistance ofjoints has been measured up to 3 GHz.
Název v anglickém jazyce
Influence of Intermetallic Compounds on RF Resistance of Joints Soldered with Lead Free Alloys
Popis výsledku anglicky
During soldering process intermetallic compounds as a reaction between solder and substrate are created. Physical properties of those compounds are different to properties of solder and substrate. The influence of intermetallic compounds (IMC) on radio frequency resistance of soldered joint has been identified. Tested solders were lead free Sn-1Cu, Sn-4Ag and Sn-3.8Ag-0.7Cu and lead containing Sn-37Pb (all in weight percent). Samples were annealed up to 3000 hours at 150 °C to accelerated growing of IMC. Radio frequency measuring method has been developed and is described. Influence of IMC on resistance of joint is growing with growing frequency because IMC with slightly different resistivity to base solder is creating barrier to current. Resistance ofjoints has been measured up to 3 GHz.
Klasifikace
Druh
J<sub>x</sub> - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)
CEP obor
JA - Elektronika a optoelektronika, elektrotechnika
OECD FORD obor
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Návaznosti výsledku
Projekt
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Návaznosti
S - Specificky vyzkum na vysokych skolach
Ostatní
Rok uplatnění
2012
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Údaje specifické pro druh výsledku
Název periodika
Radioengineering
ISSN
1210-2512
e-ISSN
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Svazek periodika
21
Číslo periodika v rámci svazku
2
Stát vydavatele periodika
CZ - Česká republika
Počet stran výsledku
7
Strana od-do
573-579
Kód UT WoS článku
000305713000006
EID výsledku v databázi Scopus
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