Influence of type of reflow technology and type of surface finish on tomb stone effect

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F13%3A00210817" target="_blank" >RIV/68407700:21230/13:00210817 - isvavai.cz</a>

Výsledek na webu

<a href="http://dx.doi.org/10.1109/ISSE.2013.6648229" target="_blank" >http://dx.doi.org/10.1109/ISSE.2013.6648229</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE.2013.6648229" target="_blank" >10.1109/ISSE.2013.6648229</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Influence of type of reflow technology and type of surface finish on tomb stone effect

Popis výsledku v původním jazyce

Surface mount technology has many problems during production. One of them is a problem called tombstone effect. Tombstone effect is a well known phenomenon, when one end of the component (commonly small passive devices such as resistor or capacitor), rises up out of the solder pad and breaks conductive contact. This article focus on the problem with tombstone effect, in concrete in this article we studied the influence of type of reflow technology and type of surface finish on tomb stone effect. In ourexperiments three types of reflow technologies, three sizes of SMD components, one type of solder paste and three types of surface finishes were used.

Název v anglickém jazyce

Influence of type of reflow technology and type of surface finish on tomb stone effect

Popis výsledku anglicky

Surface mount technology has many problems during production. One of them is a problem called tombstone effect. Tombstone effect is a well known phenomenon, when one end of the component (commonly small passive devices such as resistor or capacitor), rises up out of the solder pad and breaks conductive contact. This article focus on the problem with tombstone effect, in concrete in this article we studied the influence of type of reflow technology and type of surface finish on tomb stone effect. In ourexperiments three types of reflow technologies, three sizes of SMD components, one type of solder paste and three types of surface finishes were used.

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2013

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Book of Abstracts

ISBN

978-606-613-064-6

ISSN

—

e-ISSN

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Počet stran výsledku

4

Strana od-do

132-135

Název nakladatele

1 Decembrie 1918 University

Místo vydání

Alba Iulia

Místo konání akce

Alba Iulia

Datum konání akce

8. 5. 2013

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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