Measurements of solder paste viscosity during its tempering and aging
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F14%3A00221828" target="_blank" >RIV/68407700:21230/14:00221828 - isvavai.cz</a>
Výsledek na webu
<a href="http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6887590&isnumber=6887550" target="_blank" >http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6887590&isnumber=6887550</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2014.6887590" target="_blank" >10.1109/ISSE.2014.6887590</a>
Alternativní jazyky
Jazyk výsledku
angličtina
Název v původním jazyce
Measurements of solder paste viscosity during its tempering and aging
Popis výsledku v původním jazyce
Solder paste printing is one of the most important steps in the surface mount technology, which has high influence on the resulting quality of solder joints. To achieve a good joint quality, the solder paste should have specific properties like adhesion,viscosity, size of the solder alloy particles, amount of flux etc. This paper is focused on the measurement of the solder paste viscosity during its tempering and aging with possibility of regeneration of solder paste properties by jelly flux. Three types of solder pastes were used in the experiment: Sn95.5Ag4Cu0.5, Sn96.5Ag3Cu0.5 and Sn62Pb36Ag2. Viscosity of solder paste is measured from storing temperature to the ambient temperature. Aging of solder pastes is made in ambient atmosphere. Regenerationof solder paste properties after aging was done by adding of jelly flux Amtech 4300/LF-4300-TF. The viscosity of pure solder paste before aging, pure solder paste after aging and solder paste after aging regenerated by jelly flux was mea
Název v anglickém jazyce
Measurements of solder paste viscosity during its tempering and aging
Popis výsledku anglicky
Solder paste printing is one of the most important steps in the surface mount technology, which has high influence on the resulting quality of solder joints. To achieve a good joint quality, the solder paste should have specific properties like adhesion,viscosity, size of the solder alloy particles, amount of flux etc. This paper is focused on the measurement of the solder paste viscosity during its tempering and aging with possibility of regeneration of solder paste properties by jelly flux. Three types of solder pastes were used in the experiment: Sn95.5Ag4Cu0.5, Sn96.5Ag3Cu0.5 and Sn62Pb36Ag2. Viscosity of solder paste is measured from storing temperature to the ambient temperature. Aging of solder pastes is made in ambient atmosphere. Regenerationof solder paste properties after aging was done by adding of jelly flux Amtech 4300/LF-4300-TF. The viscosity of pure solder paste before aging, pure solder paste after aging and solder paste after aging regenerated by jelly flux was mea
Klasifikace
Druh
D - Stať ve sborníku
CEP obor
JA - Elektronika a optoelektronika, elektrotechnika
OECD FORD obor
—
Návaznosti výsledku
Projekt
—
Návaznosti
S - Specificky vyzkum na vysokych skolach
Ostatní
Rok uplatnění
2014
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Údaje specifické pro druh výsledku
Název statě ve sborníku
37th Int. Spring Seminar on Electronics Technology
ISBN
978-1-4799-4455-2
ISSN
—
e-ISSN
—
Počet stran výsledku
4
Strana od-do
189-192
Název nakladatele
IEEE
Místo vydání
New York
Místo konání akce
Drážďany
Datum konání akce
7. 5. 2014
Typ akce podle státní příslušnosti
WRD - Celosvětová akce
Kód UT WoS článku
000346580500038