The influence of the crystallographic structure of the intermetallic grains on tin whisker growth

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F19%3A00327713" target="_blank" >RIV/68407700:21230/19:00327713 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.1016/j.jallcom.2019.01.247" target="_blank" >https://doi.org/10.1016/j.jallcom.2019.01.247</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1016/j.jallcom.2019.01.247" target="_blank" >10.1016/j.jallcom.2019.01.247</a>

Jazyk výsledku

angličtina

Název v původním jazyce

The influence of the crystallographic structure of the intermetallic grains on tin whisker growth

Popis výsledku v původním jazyce

In this paper, the relationship between the crystallographic structure of Cu-Sn intermetallic grains and Sn whisker growth was investigated. In order to prevent the influence of the elements in the alloy composition and the effect of the soldering process on the formation of the intermetallic layer, 99.99% pure Sn was vacuum evaporated onto Cu substrates. The Sn layer thickness was sub-micron region (~400 nm in average) to reach considerable and rapid compressive stress on the tin layer originated by the intermetallic formation. The samples were stored at room temperature for 1 month. Different types of whiskers (nodule and filament) and the layer structure underneath were studied with a scanning ion microscopy and transmission electron microscopy. It was found that not only the thickness of the intermetallic layer and shape of the intermetallic grains affects the whisker growth but the crystallo- graphic structure of the intermetallic grains as well. The susceptibility of the Sn layer to whisker development is higher in those regions where the intermetallic layer is composed of monocrystalline grains instead of those regions, where it is composed of polycrystalline grains. This effect can be explained by the higher compressive stress generated by the monocrystalline intermetallics compared to the polycrystalline ones.

Název v anglickém jazyce

The influence of the crystallographic structure of the intermetallic grains on tin whisker growth

Popis výsledku anglicky

In this paper, the relationship between the crystallographic structure of Cu-Sn intermetallic grains and Sn whisker growth was investigated. In order to prevent the influence of the elements in the alloy composition and the effect of the soldering process on the formation of the intermetallic layer, 99.99% pure Sn was vacuum evaporated onto Cu substrates. The Sn layer thickness was sub-micron region (~400 nm in average) to reach considerable and rapid compressive stress on the tin layer originated by the intermetallic formation. The samples were stored at room temperature for 1 month. Different types of whiskers (nodule and filament) and the layer structure underneath were studied with a scanning ion microscopy and transmission electron microscopy. It was found that not only the thickness of the intermetallic layer and shape of the intermetallic grains affects the whisker growth but the crystallo- graphic structure of the intermetallic grains as well. The susceptibility of the Sn layer to whisker development is higher in those regions where the intermetallic layer is composed of monocrystalline grains instead of those regions, where it is composed of polycrystalline grains. This effect can be explained by the higher compressive stress generated by the monocrystalline intermetallics compared to the polycrystalline ones.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2019

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Journal of Alloys and Compounds

ISSN

0925-8388

e-ISSN

1873-4669

Svazek periodika

785

Číslo periodika v rámci svazku

May

Stát vydavatele periodika

NL - Nizozemsko

Počet stran výsledku

7

Strana od-do

774-780

Kód UT WoS článku

000460386900093

EID výsledku v databázi Scopus

2-s2.0-85060554965