Study of Solder Spreadability at Different Soldering Conditions Using Factorial Experiments

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F19%3A00338223" target="_blank" >RIV/68407700:21230/19:00338223 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.1109/ISSE.2019.8810262" target="_blank" >https://doi.org/10.1109/ISSE.2019.8810262</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE.2019.8810262" target="_blank" >10.1109/ISSE.2019.8810262</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Study of Solder Spreadability at Different Soldering Conditions Using Factorial Experiments

Popis výsledku v původním jazyce

The solder spreadability on the soldering surfaces is one of the critical parameters for reflow soldering which is used for electronic assembly. Solder spreadability gives us knowledge about wetting, surface tensions, and reliability issues like bridging etc. This article deals with full factorial experiments of solders spreadability of four different surface finishes (passivated copper, electroless nickel immersion gold - ENIG, immersion tin - ImSn and hot air solder levelling - HASL), and five types of solder paste with the following solder alloy composition: Sn62Pb36Ag2, Sn95.5Ag4Cu0.5, Sn96.5Ag3.5, Sn96.5Ag3Cu0.5, Sn42Bi58. Additionally, three different reflow soldering techniques (infra radiation, convection air and vapour phase soldering) were used in the experiment. The use of factorial experiments is a novelty in our approach. Results show that all used materials and solder pastes have good spreadability. The best results were achieved for copper surface finish.

Název v anglickém jazyce

Study of Solder Spreadability at Different Soldering Conditions Using Factorial Experiments

Popis výsledku anglicky

The solder spreadability on the soldering surfaces is one of the critical parameters for reflow soldering which is used for electronic assembly. Solder spreadability gives us knowledge about wetting, surface tensions, and reliability issues like bridging etc. This article deals with full factorial experiments of solders spreadability of four different surface finishes (passivated copper, electroless nickel immersion gold - ENIG, immersion tin - ImSn and hot air solder levelling - HASL), and five types of solder paste with the following solder alloy composition: Sn62Pb36Ag2, Sn95.5Ag4Cu0.5, Sn96.5Ag3.5, Sn96.5Ag3Cu0.5, Sn42Bi58. Additionally, three different reflow soldering techniques (infra radiation, convection air and vapour phase soldering) were used in the experiment. The use of factorial experiments is a novelty in our approach. Results show that all used materials and solder pastes have good spreadability. The best results were achieved for copper surface finish.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2019

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2019 42nd International Spring Seminar on Electronics Technology (ISSE)

ISBN

978-1-7281-1874-1

ISSN

2161-2528

e-ISSN

2161-2536

Počet stran výsledku

4

Strana od-do

—

Název nakladatele

IEEE Press

Místo vydání

New York

Místo konání akce

Wroclaw

Datum konání akce

15. 5. 2019

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000507501000034