Wetting Balance Test of Tin-Based Solder Alloys: Effect of Oxide Removal on Wetting Performance

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F25%3A00384650" target="_blank" >RIV/68407700:21230/25:00384650 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.1109/ISSE65583.2025.11121031" target="_blank" >https://doi.org/10.1109/ISSE65583.2025.11121031</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE65583.2025.11121031" target="_blank" >10.1109/ISSE65583.2025.11121031</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Wetting Balance Test of Tin-Based Solder Alloys: Effect of Oxide Removal on Wetting Performance

Popis výsledku v původním jazyce

This study investigates the influence of the dwell time between the mechanical oxide removal from the surface of the molten solder by a scraper and the initiation of the wetting balance test on the wettability of copper. This prolongation could potentially influence soldering performance and has not been studied yet. Copper wire with a cross-sectional area of 1.5 mm2, rosin-based flux, and three different lead-free solder alloys (SnAg3Cu0.5,SnAg4, and SnCu3) were utilized for this experiment. Our findings revealed that the oxidation of the solder surface during the time delay of up to 10 minutes has a negligible effect on the wettability of the copper for all of the utilized alloys regardless of the flux application. However, when no flux was applied to the Cu wire, this time delay affected wetting behavior, particularly of SnAg4 and SnCu3 alloys, which exhibited heightened surface oxidation sensitivity in contrast to SnAg3Cu0.5. These results demonstrated that it is not necessary to extensively monitor the cleanliness of the molten solder surface during the wetting balance test, nor in processes like wave soldering.

Název v anglickém jazyce

Wetting Balance Test of Tin-Based Solder Alloys: Effect of Oxide Removal on Wetting Performance

Popis výsledku anglicky

This study investigates the influence of the dwell time between the mechanical oxide removal from the surface of the molten solder by a scraper and the initiation of the wetting balance test on the wettability of copper. This prolongation could potentially influence soldering performance and has not been studied yet. Copper wire with a cross-sectional area of 1.5 mm2, rosin-based flux, and three different lead-free solder alloys (SnAg3Cu0.5,SnAg4, and SnCu3) were utilized for this experiment. Our findings revealed that the oxidation of the solder surface during the time delay of up to 10 minutes has a negligible effect on the wettability of the copper for all of the utilized alloys regardless of the flux application. However, when no flux was applied to the Cu wire, this time delay affected wetting behavior, particularly of SnAg4 and SnCu3 alloys, which exhibited heightened surface oxidation sensitivity in contrast to SnAg3Cu0.5. These results demonstrated that it is not necessary to extensively monitor the cleanliness of the molten solder surface during the wetting balance test, nor in processes like wave soldering.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20501 - Materials engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2025

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2025 International Spring Seminar on Electronics Technology (ISSE)

ISBN

979-8-3315-1217-0

ISSN

2161-2536

e-ISSN

2161-2528

Počet stran výsledku

4

Strana od-do

—

Název nakladatele

Institute of Electrical and Electronics Engineers

Místo vydání

New York

Místo konání akce

Budapešť

Datum konání akce

14. 5. 2025

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

001585293500074