Tepelná stabilita plasmaticky deponovaných polysilanů

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F70883521%3A28110%2F06%3A63504636" target="_blank" >RIV/70883521:28110/06:63504636 - isvavai.cz</a>

Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Thermal stability of plasma deposited polysilanes

Popis výsledku v původním jazyce

A new method for studying thermal stability and concomitant chemical composition changes on thermal treatment of thin polymeric films is presented. It is applied to the study of thermal properties and modification of properties of polysilane-like materials with variable dimensionality prepared by radio frequency plasma enhanced chemical vapour deposition (CVD). Structure and microphysical properties of these materials, modified by progressive annealing, are examined by fluorimetry, FTIR absorption spectroscopy and XPS. In addition, the role, bonding conditions and structural environments of organic moieties as well as their influence on thermal degradation processes are examined. It is found that plasma polysilanes undergo three consecutive thermal degradation processes: Si-Si bond cleavage, elimination of side groups and final carbide formation. Presence of disorder and crosslinking stabilises the plasmatic material in comparison to classically prepared polysilanes. Nanostructural uni

Název v anglickém jazyce

Thermal stability of plasma deposited polysilanes

Popis výsledku anglicky

A new method for studying thermal stability and concomitant chemical composition changes on thermal treatment of thin polymeric films is presented. It is applied to the study of thermal properties and modification of properties of polysilane-like materials with variable dimensionality prepared by radio frequency plasma enhanced chemical vapour deposition (CVD). Structure and microphysical properties of these materials, modified by progressive annealing, are examined by fluorimetry, FTIR absorption spectroscopy and XPS. In addition, the role, bonding conditions and structural environments of organic moieties as well as their influence on thermal degradation processes are examined. It is found that plasma polysilanes undergo three consecutive thermal degradation processes: Si-Si bond cleavage, elimination of side groups and final carbide formation. Presence of disorder and crosslinking stabilises the plasmatic material in comparison to classically prepared polysilanes. Nanostructural uni

Druh

J_x - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)

CEP obor

CD - Makromolekulární chemie

OECD FORD obor

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Projekt

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Návaznosti

Z - Vyzkumny zamer (s odkazem do CEZ)

Rok uplatnění

2006

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Polymer Degradation and Stability

ISSN

0141-3910

e-ISSN

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Svazek periodika

91

Číslo periodika v rámci svazku

12

Stát vydavatele periodika

GB - Spojené království Velké Británie a Severního Irska

Počet stran výsledku

10

Strana od-do

2901-2910

Kód UT WoS článku

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EID výsledku v databázi Scopus

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